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Emhart Dynapert EDB 520 Eutectic Die Bonder

The Emhart Dynapert EDB 520 is designed to align and pick-up semiconductor chips or other, similar devices from a waffle pack, mirror tray or unexpanded die matrix. The EDB 520 will then transfer the chip/device from this position on to a heated work position; the chip will then be eutectically bonded to a package.


Features and Frequencies:

  • 6.1/2 total horizontal arm movement
  • 0.5 maximum vertical arm movement
  • + 0.015 adjustable amplitude for scrub action which can be edited from mechanical screws at the back of the arm
  • 4 15 Hz/sec adjustable frequency for scrub action
  • 0.4 dB Amplitude Accuracy



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